Wincomm Launches New Fanless Panel PC WLP-7920-15H with Wide Temperature/Optical Bonding/Sunlight Readable

Suitable for harsh outdoor environment with exclusive thermal design featuring thermal conductivity up to 7000 W/mk

In order to meet the needs of specific applications, like Outdoor Kiosk, boats, automated control and others, Wincomm introduces the WLP-7920-15H. It is rated as the industry’s genuine comprehensive, wide-temperature range, high-brightness Panel PC. In addition to its exclusive fanless thermal design mechanism, the motherboard also has a specially designed preheat circuit to ensure low temperature booting and operation. Regarding component selection, rigorous temperature testing has been performed, from the components to the motherboard, unlike the sorting method employed by the industry in general, where quality cannot be fully guaranteed. Paired with a 1000 nits anti-glare LCD the WLP-7920-15H remains clear and readable even under direct sunlight. In addition, combined with Optical Bonding to extend screen lifespan, it prevents fogging in locations with large temperature fluctuation. In low light environments (for example, on ships) the super dimming can be adjusted to under 5 nits. Integrating the 5 aforementioned features: fanless structure, wide temperature range as well as antiglare, optical bonding, and super dimming screen, users are unaffected by harsh environmental experienced during operation.

 

Fanless mechanic design:

 

The Fanless mechanic design of a wide temperature range product must consider how the product maintains normal operation in high temperatures environment. The WLP-7920-15H has excellent heat dissipation capacity in high temperature environments due to its heat pipe design with a coefficient as high as 7000 W/mk. Compared to other products on the market, the WLP-7920-15H is integrally molded, easy to assemble and disassemble, and possesses undiminished thermal efficiency that completely conforms to the demands of users.

 

Caption: Integrally molded thermal design with extremely high thermal efficiency

   
 

 

Exclusive -20~60℃ wide temperature range motherboard design & component checks

 

WLP-7920-15H motherboard's preheat circuit for low temperature environments users are free from worrying about motherboard components failure caused by low temperatures. The peripheral components of this system such as the LCD, touch, RAM, SSD, and HDD are all rigorously selected for their wide temperature range designs rather than the common sorting method commonly adopted in the industry. Your WLP-7920-15H is assured to run 24/7 365 nonstop in environments between 20~60℃ .

 

Sunlight Readable

 

In addition to being applicable in a wide temperature range, the WLP-7920-15H is equipped with a 1000 nits optical bonding sunlight readable LCD for outdoor use. Even in direct sunlight, the screen remains clear and readable. The core method for outdoor readability is increasing display brightness in opposition to sunlight. The LED backlight module used by the WLP-7920-15H allows the display to be brighter, more efficient, and energy saving.

Even though high brightness backlight technology is very important, it is only part of the solution. The strength of direct sunlight is normally in the range of 10,000 to 100,000 Lux, which is significantly higher than display brightness. Touch screens normally have 5 layers. Each layer reflects about 4% of sunlight, which causes up to 20% of environmental light to reflect onto the user. Thus, the outermost layer of Optical Bonding must be employed to reduce reflected light. Wincomm provides professional high brightness solutions for outdoor applications.

 

Optical bonding

 

Optical bonding reduces reflection effectively to maintain display clarity and prevent display aging as well as strengthens the screen to be more impact resistant. Another merit of optical bonding lies in its prevention against internal condensation which, in turn, frees the screen from fogging in outdoor environment with large temperature changes.

 

Caption: The advantages of Bonding